SUNSHINE SP-50 CPU SOLDERING PASTE
Out Of Stock
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Description :
1. 158 degree ,Customized for BGA IC welding .
2.?soldering joint bright ,full Wuxi beats , moderate viscosity
3.After welding ,less residue ,appearance ?and transparency ,high insulation resistance .
4.Has good wettability ,excellent welding
|
Name |
SUNSHINE 158 ℃ BGA CPU Solder Paste |
|
Diameter |
28mm |
|
Weight |
50g |
|
Particle size |
20-38um |
|
Conductivity rate |
14 |
|
flux content |
9+-0.5 |
|
Viscosity |
178+-10 |
|
Feature |
low smoke,RoHs solder paste,non-corroding |
|
Melting point |
158 degree |
|
Application |
Mobile CPU |
Application:
Mobile phone chip repair, computer repair, Home Appliances repair, appliance repair or customized for BGA IC welding
